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# A. ECAD Design Information
This information supports the development of the PCB ECAD model for this device. It is intended to be used by PCB designers.
## A.1 Part Number Indexing
| Orderable Part Number | Number of Pins | Package Type | Package Code/POD Number |
| --- | --- | --- | --- |
| RAA489118ARGNP#AA0 | 32 | TQFN | L32.4x4D |
| RAA489118ARGNP#HA0 | 32 | TQFN | L32.4x4D |
| RAA489118A3GNP#AA0 | 32 | TQFN | L32.4x4D |
| RAA489118A3GNP#HA0 | 32 | TQFN | L32.4x4D |
| RAA489118A3GNP#MA0 | 32 | TQFN | L32.4x4D |
## A.2 Symbol Pin Information
### A.2.1 32-TQFN
| Pin Number | Primary Pin Name | Primary Electrical Type | Alternate Pin Name(s) |
| --- | --- | --- | --- |
| 1 | `CSON` | Input | - |
| 2 | `CSOP` | Input | - |
| 3 | `VSYS` | Input | - |
| 4 | `BOOT2` | Power | - |
| 5 | `UGATE2` | Output | - |
| 6 | `PHASE2` | Power | - |
| 7 | `LGATE2` | Output | - |
| 8 | `VDDP` | Power | - |
| 9 | `LGATE1` | Output | - |
| 10 | `PHASE1` | Power | - |
| 11 | `UGATE1` | Output | - |
| 12 | `BOOT1` | Power | - |
| 13 | `ASGATE` | Output | - |
| 14 | `CSIN` | Input | - |
| 15 | `CSIP` | Input | - |
| 16 | `ADP` | Input | - |
| 17 | `DCIN` | Power | - |
| 18 | `VDD` | Power | - |
| 19 | `ACIN` | Input | - |
| 20 | `OTGEN` | Input | `CMIN` |
| 21 | `SDA` | I/O | - |
| 22 | `SCL` | I/O | - |
| 23 | `PROCHOT#` | Output | - |
| 24 | `ACOK` | Output | - |
| 25 | `BATGONE` | Input | - |
| 26 | `OTGPG` | Output | `CMOUT` |
| 27 | `PROG` | Input | - |
| 28 | `COMP` | Output | - |
| 29 | `AMON` | Output | `BMON` |
| 30 | `CONFIG` | I/O | `PSYS` |
| 31 | `VBAT` | Input | - |
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| Pin Number | Primary Pin Name | Primary Electrical Type | Alternate Pin Name(s) |
| --- | --- | --- | --- |
| 32 | `BGATE` | Output | - |
| EPAD33 | `GND` | Power | - |
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## A.3 Symbol Parameters
| Orderable Part Number | Qualification | Mounting Type | Min Input Voltage | Max Input Voltage | Min Output Voltage | Max Output Voltage | Min Operating Temperature | Max Operating Temperature | RoHS | Trickle Charging | Typ Switching Frequency | Switcher Configuration |
| --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- |
| RAA489118ARGNP#AA0 | Consumer | SMD | 3.9 V | 30 V | 2.4 V | 30.8 V | -10° C | +100° C | Yes | Yes | 732 KHz | Buck, Boost, and Buck-Boost |
| RAA489118ARGNP#HA0 | Consumer | SMD | 3.9 V | 30 V | 2.4 V | 30.8 V | -10° C | +100° C | Yes | Yes | 732 KHz | Buck, Boost, and Buck-Boost |
| RAA489118A3GNP#AA0 | Industrial | SMD | 3.9 V | 30 V | 2.4 V | 30.8 V | -40° C | +105° C | Yes | Yes | 732 KHz | Buck, Boost, and Buck-Boost |
| RAA489118A3GNP#HA0 | Industrial | SMD | 3.9 V | 30 V | 2.4 V | 30.8 V | -40° C | +105° C | Yes | Yes | 732 KHz | Buck, Boost, and Buck-Boost |
| RAA489118A3GNP#MA0 | Industrial | SMD | 3.9 V | 30 V | 2.4 V | 30.8 V | -40° C | +105° C | Yes | Yes | 732 KHz | Buck, Boost, and Buck-Boost |
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## A.4 Footprint Design Information
### A.4.1 32-TQFN
| IPC Footprint Type | Package Code/ POD number | Number of Pins |
| --- | --- | --- |
| QFN | L32.4x4D | 32 |
| Description | Dimension | Value (mm) | Diagram |
| --- | --- | --- | --- |
| Minimum body span (vertical side) | `Dmin` | 3.95 | |
| Maximum body span (vertical side) | `Dmax` | 4.05 | |
| Minimum body span (horizontal side) | `Emin` | 3.95 | |
| Maximum body span (horizontal side) | `Emax` | 4.05 | |
| Minimum Lead Width | `Bmin` | 0.15 | |
| Maximum Lead Width | `Bmax` | 0.25 | |
| Minimum Lead Length | `Lmin` | 0.25 | |
| Maximum Lead Length | `Lmax` | 0.35 | |
| Maximum Height | `Amax` | 0.8 | |
| Minimum Standoff Height | `A1min` | 0 | |
| Minimum Lead Thickness | `cmin` | 0.15 | |
| Maximum Lead Thickness | `cmax` | 0.25 | |
| Number of pins (vertical side) | `PinCountD` | 8 | |
| Number of pins (horizontal side) | `PinCountE` | 8 | |
| Distance between the center of any two adjacent pins (vertical side) | `PitchD` | 0.4 | |
| Distance between the center of any two adjacent pins (horizontal side) | `PitchE` | 0.4 | |
| Location of pin 1; S2 = corner of D side, C1 = center of E side | `Pin1` | S2 | |
| Minimum thermal pad size (vertical side) | `D2min` | 2.6 | |
| Maximum thermal pad size (vertical side) | `D2max` | 2.8 | |
| Minimum thermal pad size (horizontal side) | `E2min` | 2.6 | |
| Maximum thermal pad size (horizontal side) | `E2max` | 2.8 | |
The "Diagram" column of the table above is a single cell spanning every row. It
holds the following drawings, which carry no printed figure number and no
printed caption:
![Footprint dimensions diagram (uncaptioned drawing in the printed "Diagram" cell)](A-ecad-design-information/footprint-dimensions-diagram.png)
| Recommended Land Pattern | Recommended Land Pattern | Recommended Land Pattern | Recommended Land Pattern |
| --- | --- | --- | --- |
| Description | Dimension | Value (mm) | Diagram |
| Distance between left pad toe to right pad toe (horizontal side) | `ZE` | 4.4 | |
| Distance between top pad toe to bottom pad toe (vertical side) | `ZD` | 4.4 | |
| Distance between left pad heel to right pad heel (horizontal side) | `GE` | 3.4 | |
| Distance between top pad heel to bottom pad heel (vertical side) | `GD` | 3.4 | |
| Pad Width | `X` | 0.2 | |
| Pad Length | `Y` | 0.5 | |
The "Diagram" column of the Recommended Land Pattern table is a single cell
spanning every row. It holds the following drawing, which carries no printed
figure number and no printed caption:
![Recommended land pattern diagram (uncaptioned drawing in the printed "Diagram" cell)](A-ecad-design-information/recommended-land-pattern-diagram.png)