# A. ECAD Design Information This information supports the development of the PCB ECAD model for this device. It is intended to be used by PCB designers. ## A.1 Part Number Indexing | Orderable Part Number | Number of Pins | Package Type | Package Code/POD Number | | --- | --- | --- | --- | | RAA489118ARGNP#AA0 | 32 | TQFN | L32.4x4D | | RAA489118ARGNP#HA0 | 32 | TQFN | L32.4x4D | | RAA489118A3GNP#AA0 | 32 | TQFN | L32.4x4D | | RAA489118A3GNP#HA0 | 32 | TQFN | L32.4x4D | | RAA489118A3GNP#MA0 | 32 | TQFN | L32.4x4D | ## A.2 Symbol Pin Information ### A.2.1 32-TQFN | Pin Number | Primary Pin Name | Primary Electrical Type | Alternate Pin Name(s) | | --- | --- | --- | --- | | 1 | `CSON` | Input | - | | 2 | `CSOP` | Input | - | | 3 | `VSYS` | Input | - | | 4 | `BOOT2` | Power | - | | 5 | `UGATE2` | Output | - | | 6 | `PHASE2` | Power | - | | 7 | `LGATE2` | Output | - | | 8 | `VDDP` | Power | - | | 9 | `LGATE1` | Output | - | | 10 | `PHASE1` | Power | - | | 11 | `UGATE1` | Output | - | | 12 | `BOOT1` | Power | - | | 13 | `ASGATE` | Output | - | | 14 | `CSIN` | Input | - | | 15 | `CSIP` | Input | - | | 16 | `ADP` | Input | - | | 17 | `DCIN` | Power | - | | 18 | `VDD` | Power | - | | 19 | `ACIN` | Input | - | | 20 | `OTGEN` | Input | `CMIN` | | 21 | `SDA` | I/O | - | | 22 | `SCL` | I/O | - | | 23 | `PROCHOT#` | Output | - | | 24 | `ACOK` | Output | - | | 25 | `BATGONE` | Input | - | | 26 | `OTGPG` | Output | `CMOUT` | | 27 | `PROG` | Input | - | | 28 | `COMP` | Output | - | | 29 | `AMON` | Output | `BMON` | | 30 | `CONFIG` | I/O | `PSYS` | | 31 | `VBAT` | Input | - | | Pin Number | Primary Pin Name | Primary Electrical Type | Alternate Pin Name(s) | | --- | --- | --- | --- | | 32 | `BGATE` | Output | - | | EPAD33 | `GND` | Power | - | ## A.3 Symbol Parameters | Orderable Part Number | Qualification | Mounting Type | Min Input Voltage | Max Input Voltage | Min Output Voltage | Max Output Voltage | Min Operating Temperature | Max Operating Temperature | RoHS | Trickle Charging | Typ Switching Frequency | Switcher Configuration | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | RAA489118ARGNP#AA0 | Consumer | SMD | 3.9 V | 30 V | 2.4 V | 30.8 V | -10° C | +100° C | Yes | Yes | 732 KHz | Buck, Boost, and Buck-Boost | | RAA489118ARGNP#HA0 | Consumer | SMD | 3.9 V | 30 V | 2.4 V | 30.8 V | -10° C | +100° C | Yes | Yes | 732 KHz | Buck, Boost, and Buck-Boost | | RAA489118A3GNP#AA0 | Industrial | SMD | 3.9 V | 30 V | 2.4 V | 30.8 V | -40° C | +105° C | Yes | Yes | 732 KHz | Buck, Boost, and Buck-Boost | | RAA489118A3GNP#HA0 | Industrial | SMD | 3.9 V | 30 V | 2.4 V | 30.8 V | -40° C | +105° C | Yes | Yes | 732 KHz | Buck, Boost, and Buck-Boost | | RAA489118A3GNP#MA0 | Industrial | SMD | 3.9 V | 30 V | 2.4 V | 30.8 V | -40° C | +105° C | Yes | Yes | 732 KHz | Buck, Boost, and Buck-Boost | ## A.4 Footprint Design Information ### A.4.1 32-TQFN | IPC Footprint Type | Package Code/ POD number | Number of Pins | | --- | --- | --- | | QFN | L32.4x4D | 32 | | Description | Dimension | Value (mm) | Diagram | | --- | --- | --- | --- | | Minimum body span (vertical side) | `Dmin` | 3.95 | | | Maximum body span (vertical side) | `Dmax` | 4.05 | | | Minimum body span (horizontal side) | `Emin` | 3.95 | | | Maximum body span (horizontal side) | `Emax` | 4.05 | | | Minimum Lead Width | `Bmin` | 0.15 | | | Maximum Lead Width | `Bmax` | 0.25 | | | Minimum Lead Length | `Lmin` | 0.25 | | | Maximum Lead Length | `Lmax` | 0.35 | | | Maximum Height | `Amax` | 0.8 | | | Minimum Standoff Height | `A1min` | 0 | | | Minimum Lead Thickness | `cmin` | 0.15 | | | Maximum Lead Thickness | `cmax` | 0.25 | | | Number of pins (vertical side) | `PinCountD` | 8 | | | Number of pins (horizontal side) | `PinCountE` | 8 | | | Distance between the center of any two adjacent pins (vertical side) | `PitchD` | 0.4 | | | Distance between the center of any two adjacent pins (horizontal side) | `PitchE` | 0.4 | | | Location of pin 1; S2 = corner of D side, C1 = center of E side | `Pin1` | S2 | | | Minimum thermal pad size (vertical side) | `D2min` | 2.6 | | | Maximum thermal pad size (vertical side) | `D2max` | 2.8 | | | Minimum thermal pad size (horizontal side) | `E2min` | 2.6 | | | Maximum thermal pad size (horizontal side) | `E2max` | 2.8 | | The "Diagram" column of the table above is a single cell spanning every row. It holds the following drawings, which carry no printed figure number and no printed caption:  | Recommended Land Pattern | Recommended Land Pattern | Recommended Land Pattern | Recommended Land Pattern | | --- | --- | --- | --- | | Description | Dimension | Value (mm) | Diagram | | Distance between left pad toe to right pad toe (horizontal side) | `ZE` | 4.4 | | | Distance between top pad toe to bottom pad toe (vertical side) | `ZD` | 4.4 | | | Distance between left pad heel to right pad heel (horizontal side) | `GE` | 3.4 | | | Distance between top pad heel to bottom pad heel (vertical side) | `GD` | 3.4 | | | Pad Width | `X` | 0.2 | | | Pad Length | `Y` | 0.5 | | The "Diagram" column of the Recommended Land Pattern table is a single cell spanning every row. It holds the following drawing, which carries no printed figure number and no printed caption: