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markdowned-datasheets/REN_RAA489118/11-13-package-ordering-revision.md
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11. Package Outline Drawing

The package outline drawing is located at the end of this document and is accessible from the Renesas website. The package information is the most current data available and is subject to change without revision of this document.

12. Ordering Information

Part Number[1][2] Part Marking Package Description[3]
(RoHS Compliant)		 Pkg. Dwg # Carrier Type[4] Temp. Range
RAA489118ARGNP#AA0 489118 ARGNPA 32 Ld 4x4 TQFN L32.4x4D Tray -10 to +100°C
RAA489118ARGNP#HA0 489118 ARGNPA 32 Ld 4x4 TQFN L32.4x4D Reel, 6k -10 to +100°C
RAA489118A3GNP#AA0 489118 A3GNPA 32 Ld 4x4 TQFN L32.4x4D Tray -40 to +105°C
RAA489118A3GNP#HA0 489118 A3GNPA 32 Ld 4x4 TQFN L32.4x4D Reel, 6k -40 to +105°C
RAA489118A3GNP#MA0 489118 A3GNPA 32 Ld 4x4 TQFN L32.4x4D Reel, 1k -40 to +105°C
RTKA489118DE0000BU RAA489118 Evaluation Board - No BFET
RTKA489118DE0010BU RAA489118 Evaluation Board - with BFET
  1. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J-STD-020.
  2. For the Moisture Sensitivity Level (MSL) see the RAA489118 product page. For more information about MSL, see TB363.
  3. For the Pb-Free Reflow Profile, see TB493.
  4. See TB347 for details about reel specifications.

13. Revision History

Revision Date Description
2.00 Oct 28, 2025 In section 3.3 Thermal Specifications, updated the values for the Thermal Resistance parameter.
1.03 Aug 21, 2025 Updated the waveforms in Figures 10, 11, 21, and 22.
Updated Operation Mode values in Figure 39.
Updated POD L32.4x4D to the latest version.
1.02 Jan 17, 2025 Added RAA489118A3GNP#MA0 to the Ordering Information and the PCB ECAD Design Information.
1.01 Oct 24, 2024 Updated POD L32.4x4D to the latest version.
Added PCB ECAD Design Information.
1.00 Aug 9, 2024 Initial release